Accession Number : ADA262136


Title :   Department of Defense Advisory Group on Electron Devices. Special Technology Area Review on Microwave Packaging Technology. Appendix


Corporate Author : OFFICE OF THE UNDER SECRETARY OF DEFENSE (ACQUISITION) WASHINGTON DC


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a262136.pdf


Report Date : Feb 1993


Pagination or Media Count : 144


Abstract : Electronic packaging is identified as an area providing opportunity for system performance enhancement for both defense and commercial applications. The move to microwave/millimeter wave multi-chip assemblies with high density interconnects is causing a significant shift in the current practices of how packages are being designed and manufactured. The longer term trend is to move to subsystem or multi-level packaging schemes to achieve higher levels of system integration. Packaging costs are being emphasized early in system developments. Workshop goals include the following: (1) Define packaging and interconnect technology and manufacturing problems/issues; (2) Recommend solutions to these problems by developing an investment strategy that can be used by government and industry; and (3) Build upon and couple to the 2-4 Mar 92 aged electronics packaging technology star.


Descriptors :   *MANUFACTURING , *ELECTRONIC EQUIPMENT , *CHIPS(ELECTRONICS) , *MODULES(ELECTRONICS) , *MICROWAVES , *PACKAGING , *ELECTRONICS INDUSTRY , *PACKING MATERIALS , COMPUTER PROGRAMS , METAL MATRIX COMPOSITES , SEMICONDUCTORS , CERAMIC MATERIALS , THERMAL CONDUCTIVITY , INJECTION MOLDING , PACKAGED CIRCUITS , HERMETIC SEALS , WORKSHOPS , DESIGN CRITERIA , LEAKAGE(ELECTRICAL) , COMPUTER AIDED MANUFACTURING , SILICON , COSTS , MILLIMETER WAVES , CARBON FIBERS , COMPUTER AIDED DESIGN , GALLIUM ARSENIDES , FIBER REINFORCED COMPOSITES


Subject Categories : Electrical and Electronic Equipment
      Containers and Packaging
      Mfg & Industrial Eng & Control of Product Sys


Distribution Statement : APPROVED FOR PUBLIC RELEASE