Accession Number : ADA261852


Title :   Special Technology Area Review on Microwave Packaging Technology


Corporate Author : PALISADES INST FOR RESEARCH SERVICES INC ARLINGTON VA


Personal Author(s) : Terry, Becky


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a261852.pdf


Report Date : Feb 1993


Pagination or Media Count : 41


Abstract : Microwave (MW) and millimeter wave (MMW) multichip module (MCM) packaging is an emerging technology that is of great importance for both defense and commercial applications. Military applications such as radar, electronic warfare, communications, and smart munitions and commercial applications such as communications, direct broadcast satellite, cellular telephone, and automotive electronics all require MW and/or MMW electronics. The spectrum of needs ranges from low volume, high performance electronics to high volume, low cost applications. A significant aspect of realizing these components and systems will be the development of a broad range of packaging and interconnect technologies that have the required reliability and environmental protection and are affordable and applicable to both the military and commercial sectors.


Descriptors :   *INTEGRATED CIRCUITS , *MICROWAVE EQUIPMENT , *MILLIMETER WAVE EQUIPMENT , MATERIALS , PACKAGED CIRCUITS , MICROWAVE ANTENNAS , RADIOFREQUENCY , DIES , METAL MATRIX COMPOSITES


Subject Categories : Electrical and Electronic Equipment
      Radiofrequency Wave Propagation


Distribution Statement : APPROVED FOR PUBLIC RELEASE