Accession Number : ADA260901


Title :   Thermoelastic Stresses in Multi-Layered Media in Non-Uniform Temperature Fields


Descriptive Note : Final rept. Jan-Dec 1992


Corporate Author : NAVAL POSTGRADUATE SCHOOL MONTEREY CA DEPT OF MECHANICAL ENGINEERING


Personal Author(s) : Salinas, David ; Kwon, Young W ; Neibert, Michael J


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a260901.pdf


Report Date : 31 Dec 1992


Pagination or Media Count : 43


Abstract : The objective of this investigation is to determine the shear and peeling stresses in a multilayered media in a nonuniform temperature field. The temperature field is obtained by a finite element solution of the energy equation with a flux generation term in one of the media layers. The resulting thermoelastic stresses are then obtained from a finite element mode which uses a recently developed beam element with only displacement degrees of freedom. Compared to the standard beam element with rotational degrees of freedom, this element without rotational degrees of freedom more readily provides displacement continuity along interfaces between medial layers. As a result of the differences in properties such as Young's moduli, Poisson's ratio, and coefficients of thermal expansion, thermoelastic stresses develop when the multilayered media is subjected to a thermal environment.


Descriptors :   *STRESSES , *TEMPERATURE , *LAYERS , *THERMOELASTICITY , *NONUNIFORM , *MEDIA , INTERFACES , MATERIALS , FLUX(RATE) , FINITE ELEMENT ANALYSIS , DISPLACEMENT , ENERGY , PEEL STRENGTH , POISSON RATIO , ROTATION , CONTINUITY , EQUATIONS , EXPANSION , ELECTRONIC EQUIPMENT , CHIPS(ELECTRONICS) , DEGREES OF FREEDOM , COEFFICIENTS , THERMAL EXPANSION , SHEAR STRESSES , STANDARDS


Subject Categories : Electrical and Electronic Equipment
      Mechanics
      Thermodynamics


Distribution Statement : APPROVED FOR PUBLIC RELEASE