Accession Number : ADA259856


Title :   Copper/Solder Intermetallic Growth Studies


Descriptive Note : Interim rept. Oct 1991-May 1992


Corporate Author : ARMY RESEARCH LAB ADELPHI MD


Personal Author(s) : Kirchner, Kevin W ; Lucey, George K ; Geis, James


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a259856.pdf


Report Date : Dec 1992


Pagination or Media Count : 15


Abstract : This document is a summary of initial findings from a series of experiments involving copper/solder intermetallic compounds (IMC's). Particularly the study examines the IMC's contribution to the changing physical properties of a solder joint as a function of time and temperature. In these experiments Cu/Sn joint samples were placed in the hot stage of an environmental scanning electron microscope, heated to about 170 deg C, and monitored for about 3 hr. A visual documentation of events is included in this report. A real-time videotape record of the IMC growth was produced as part of the work. Additionally a working hypothesis is presented that involves the relationship between IMC's and the mechanical properties of joints.


Descriptors :   *SOLDERED JOINTS , *INTERMETALLIC COMPOUNDS , *SOLDERING ALLOYS , MECHANICAL PROPERTIES , SCANNING ELECTRON MICROSCOPES , REAL TIME , PHYSICAL PROPERTIES , GROWTH(GENERAL) , ELECTRON MICROSCOPES , COPPER , MICROSCOPES , IMAGE MOTION COMPENSATION


Subject Categories : Inorganic Chemistry
      Metallurgy and Metallography
      Couplers, Fasteners, and Joints


Distribution Statement : APPROVED FOR PUBLIC RELEASE