Accession Number : ADA259441


Title :   Processing, Fabrication, and Demonstration of HTS Integrated Microwave Circuits


Descriptive Note : Research and development status rept no. 5, 27 Jul-25 Oct 92,


Corporate Author : WESTINGHOUSE SCIENCE AND TECHNOLOGY CENTER PITTSBURGH PA


Personal Author(s) : Wagner, G R


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/a259441.pdf


Report Date : 25 Oct 1992


Pagination or Media Count : 35


Abstract : These tasks are essentially complete as reported last time, but we are continuing to monitor the progress in other technologies and the evolving subsystems requirements as they relate to the HTS components development. The packaging and characterization work reported here is related to progress made in the parallel High-Temperature Superconducting Space Environment-II (HTSSE-II) program. We have used the filters and delay line to be delivered to HTSSE-II as test vehicles for the fabrication and packaging developments achieved in this ONR/DARPA program. Although in this program this approach is appropriate since all the packaging and characterization required for repeatable results are common to all devices made in both programs.


Descriptors :   *SUPERCONDUCTORS , *INTEGRATED CIRCUITS , *MICROWAVE EQUIPMENT , FABRICATION , PROCESSING EQUIPMENT


Subject Categories : Electrical and Electronic Equipment
      Solid State Physics


Distribution Statement : APPROVED FOR PUBLIC RELEASE