Accession Number : AD1038321


Title :   Thermally Optimized Paradigm of Thermal Management (TOP-M)


Descriptive Note : Technical Report,01 Jul 2015,01 Jul 2017


Corporate Author : Technion R and D Foundation Ltd. Haifa Israel


Personal Author(s) : Nemirovsky, Yael ; Ginosar,Ran ; Malitis,Maria


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1038321.pdf


Report Date : 18 Jul 2017


Pagination or Media Count : 34


Abstract : The main goal of this research was to present a New Thermal Management Approach, which combines thermally aware Very/Ultra Large Scale Integration (VLSI/ULSI) architecture design with liquid cooling design from the very early step of the demonstrator System on Chip (SoC) design. Thermal sensors, which were integrated on several parts of the SoC, measured the on-line the local temperature, thus enabling better operation of the SoC as well as better control over the liquid cooling by providing on-line feedback. Complementary Metal Oxide Semiconductor (CMOS) Single Photon Avalanche Diode (SPAD) image sensors were used to demonstrate the new thermal management approach.


Descriptors :   complementary metaloxide semiconductors , temperature control , energy consumption , liquid cooling , fabrication , temperature coefficients , soft lithography , manufacturing , large scale integration , circuits , charge carriers , calibration , Avalanche DiodeS , PHOTONS , SYSTEMONCHIP


Subject Categories : Electrical and Electronic Equipment
      Thermodynamics


Distribution Statement : APPROVED FOR PUBLIC RELEASE