Accession Number : AD1030677


Title :   Heterogeneous IP Ecosystem enabling Reuse (HIER)


Descriptive Note : Technical Report,01 Jan 2016,31 Dec 2016


Corporate Author : UNIVERSITY OF SOUTHERN CALIFORNIA LOS ANGELES LOS ANGELES United States


Personal Author(s) : Draper,Jeffrey ; Hansford,Wes


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1030677.pdf


Report Date : 22 Mar 2017


Pagination or Media Count : 18


Abstract : In the Department of Defense (DoD) world, an Intellectual Property (IP) re-use infrastructure has been lacking, even in the digital domain. Significant investments in custom chip designs have been made by the government, but the IP resulting from such efforts is not readily available for re-use, and even in cases where IP is available, porting to a common implementation platform for integration is often cost-prohibitive. Thus, an execution model and infrastructure to enable DoD-specific IP reuse is greatly needed. While such an effort is more of an infrastructure development rather than a research endeavor, it would pay handsome dividends to the DoD with respect to more efficient, lower cost chip design efforts in the future. IP re-use for heterogeneous integration is even more challenging. IP from widely disparate technologies including silicon CMOS/BiCMOS, compound semiconductors including InP/GaN/GaAs/InGaAs need to be properly modeled and simulated in an integrated environment. The University of Southern California conducted an exploratory effort to formulate the detailed requirements for accomplishing a successful Heterogeneous IP Ecosystem enabling Reuse (HIER). The HIER project explored both fabrication process issues as well as tools issues. The results of the study identified where major investment is needed to make such a paradigm be as seamless as possible. In the course of the HIER project, DARPA also established additional concepts in the formation of the Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) program. In response to the request for information and broad agency announcement associated with the CHIPS program, the HIER project refined its approach to address requirements for that program.


Descriptors :   chips (electronics) , electrical engineering , integrated circuits , intellectual property


Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys
      Logistics, Military Facilities and Supplies


Distribution Statement : APPROVED FOR PUBLIC RELEASE