Accession Number : AD1029424


Title :   NextFlex Flexible Hybrid Electronics Manufacturing


Descriptive Note : Journal Article


Corporate Author : Army Research Laboratory Adelphi United States


Personal Author(s) : Leever,Benjamin J ; Forsythe,Eric


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1029424.pdf


Report Date : 01 Oct 2016


Pagination or Media Count : 5


Abstract : NextFlex, America's Flexible Hybrid Electronics Manufacturing Innovation Institute, is a program formed out of a cooperative agreement awarded to the nonprofit FlexTech Alliance on Aug 28, 2015. NextFlex is the seventh manufacturing innovation institute created to scale up emerging technologies, foster American innovation, and establish a U.S. manufacturing base to accelerate transition into both defense and commercial products.


Descriptors :   wearable technology , department of defense , military research , printed circuit boards , network protocols , printed circuits , monitoring , software design


Subject Categories : Electrical and Electronic Equipment


Distribution Statement : APPROVED FOR PUBLIC RELEASE