Accession Number : AD1024236

Title :   Tin Whisker Testing and Modeling

Descriptive Note : Technical Report,01 Jan 2012,01 Oct 2015

Corporate Author : BAE Systems Controls Endicott United States

Personal Author(s) : Meschter,Stephan J ; Snugovsky,Polina

Full Text :

Report Date : 01 Nov 2015

Pagination or Media Count : 305

Abstract : Driven by legislation resulting from two European Union directives, Reduction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment Regulation (WEEE), most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment beginning in 2006. The DoD must now include lead-free materials considerations in the evaluation of commercial-off-the-shelf parts and assemblies intended for use in DoD systems. In particular, lead-free tin rich finishes and solder alloys are susceptible to tin whisker growth that can cause electrical short circuits and reduced reliability. This report describes the multi-year testing and modeling program to analyze tin whisker growth on lead-free manufactured assemblies and utilizes whisker short circuit statistical modeling to enable improved reliability assessments.

Descriptors :   Short Circuits , Corrosion , Contamination , soldering alloys , reliability (electronics) , electronic components , reliability engineering

Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy

Distribution Statement : APPROVED FOR PUBLIC RELEASE