Accession Number : AD1024236


Title :   Tin Whisker Testing and Modeling


Descriptive Note : Technical Report,01 Jan 2012,01 Oct 2015


Corporate Author : BAE Systems Controls Endicott United States


Personal Author(s) : Meschter,Stephan J ; Snugovsky,Polina


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1024236.pdf


Report Date : 01 Nov 2015


Pagination or Media Count : 305


Abstract : Driven by legislation resulting from two European Union directives, Reduction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment Regulation (WEEE), most commercial electronics manufacturers began delivering lead-free electronic components, assemblies, and equipment beginning in 2006. The DoD must now include lead-free materials considerations in the evaluation of commercial-off-the-shelf parts and assemblies intended for use in DoD systems. In particular, lead-free tin rich finishes and solder alloys are susceptible to tin whisker growth that can cause electrical short circuits and reduced reliability. This report describes the multi-year testing and modeling program to analyze tin whisker growth on lead-free manufactured assemblies and utilizes whisker short circuit statistical modeling to enable improved reliability assessments.


Descriptors :   Short Circuits , Corrosion , Contamination , soldering alloys , reliability (electronics) , electronic components , reliability engineering


Subject Categories : Electrical and Electronic Equipment
      Fabrication Metallurgy


Distribution Statement : APPROVED FOR PUBLIC RELEASE