Accession Number : AD1021518


Title :   Self Diagnostic Adhesive for Bonded Joints in Aircraft Structures


Descriptive Note : Technical Report,15 Mar 2013,14 Mar 2016


Corporate Author : Leland Stanford Junior Univ CA Stanford United States


Personal Author(s) : Chang,Fu-Kuo


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1021518.pdf


Report Date : 04 Oct 2016


Pagination or Media Count : 47


Abstract : Bondline integrity is one of the most critical concerns in the design and operation of aircraft and spacecraft structures up to date. Nevertheless, current state-of-the-art non-destructive evaluation (NDE) and structural health monitoring (SHM) techniques are incapable of offering mature solutions regarding bondline integrity monitoring. Therefore, the objective of the proposed research is the development of a complete approach for integrity monitoring and self-diagnosis of adhesively bonded structures. During the reporting period, three major accomplishments were achieved:1) Screen-printed piezo-electric sensors of the new design were developed and fabricated. The new sensors had a smaller dimension compared to the previous design to minimize the parasitic effect when embedded into bondlines. 2) The developed impedance-based diagnostic algorithms were validated under the fatigue/dynamic loading condition. 3) Both SEM (Spectral Element Modeling) and FEM (Finite Element Modeling) simulation of the impedance of the embedded piezo-electric sensor was conducted.


Descriptors :   structural health monitoring , adhesives , detectors , algorithms , PIEZOELECTRIC MATERIALS , IMPEDANCE , models , finite element analysis , wave propagation , polymeric films , substrates , fabrication , LEARNING MACHINES , signal processing , prototypes , loads (forces) , advanced materials


Distribution Statement : APPROVED FOR PUBLIC RELEASE