Accession Number : AD1017374


Title :   Characterization of Magnetron Sputtered Copper-Nickel Thin Film and Alloys


Descriptive Note : Technical Report,01 Oct 2015,01 Jul 2016


Corporate Author : US Army Research Laboratory Adelphi United States


Personal Author(s) : Zakar, Eugene ; Chen,Andrew ; Burke,Robert ; Hirsch,Samuel G ; Strnad,Nicholas ; Mulcahy,James


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1017374.pdf


Report Date : 01 Sep 2016


Pagination or Media Count : 18


Abstract : Copper (Cu)-nickel (Ni) thin films are prepared by magnetron sputtering using an AJA International model ATC-2200 system. The as-deposited films are in the amorphous state during room temperature deposition but transition to a crystalline state at an elevated substrate temperature beyond 250 deg C. The crystalline films have a mixed (111)- and (200)-oriented texture that becomes predominantly (111)-orientated after an annealing treatment. Bilayer CuNi deposited films with ratio of 12:1, 6:1, 4:1, and 3:1 produced final alloy concentrations of 90/10, 83/17, 76/24, and 70/30 atomic %, respectively, after annealing, and their average surface roughness increased with higher Cu concentration. These results show that the final thin film alloy composition can be effectively controlled by varying the ratio of the initial deposited Cu and Ni layers. The morphology of these films were studied by atomic force microscope (AFM), X-ray Diffraction (XRD), electrical 4-point probe, and energy-dispersive X-ray spectroscopy (EDX).


Descriptors :   thin films , sputtering , room temperature , annealing , surface roughness , xray diffraction , chemical vapor deposition , substrates , copper nickel alloys , magnetrons , deposition , x ray spectroscopy , low pressure


Distribution Statement : APPROVED FOR PUBLIC RELEASE