This report documents the findings of a study of the U.S. electronics manufacturing industry, including an integrated assessment focused on projected advances in electronics materials and processes and their implications for military aerospace applications. A major goal of the study was to understand trends, manufacturing issuesbarriers, enabling technologies, and investment opportunities with significant potential for payoff in the context of future electronics product capabilities, especially for military aerospace applications. While the work covered the U.S. electronics industry in general, it placed special emphasis on flexible hybrid electronics FHE as an emerging and promising industry. The analysis addressed latest developments in inorganic and organic materials for specialty applications, including recent developments in 2D materials such as graphene for electronics applications. For both conventional electronics and FHE, the study included a review of materials, manufacturing processes, packaging technologies, design tools, and current and proposed applications, and identification of technology gaps and opportunities for investment. For conventional electronics, it also addressed computational tools for design of resilient electronics for severe environments. For the emerging field of FHE, the report includes estimates of future trends in applications and the technologies that are expected to enable them.