Accession Number : AD1007690


Title :   MEMS-Electronic-Photonic Heterogeneous Integrated FMCW Ladar Source


Descriptive Note : Technical Report,23 Sep 2011,31 Dec 2015


Corporate Author : The Regents of University of California, Berkley Berkley United States


Personal Author(s) : Wu,Ming C ; Boser,Bernhard ; Chang-Hasnain,Constance ; Yablonovitch,Eli


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/1007690.pdf


Report Date : 18 Dec 2015


Pagination or Media Count : 34


Abstract : The goal of this project is to develop a modular, heterogeneous integration process to combine III-V tunable VCSELs, silicon photonic integrated circuits, and CMOS ICs in a seamless manner, and demonstrate a single-chip FMCW (Frequency-Modulated Continuous-Wave) LADAR source. In Phase 2, we have successfully developed through-silicon-vias (TSVs) on Si photonics at wafer level, and stacking the Si photonic dies on top of CMOS at die level. Electrical and mechanical properties of the bonded systems were characterized. FPGA and CMOS programming using a custom graphical user interface have been implemented, and optical and electrical interfacing to the system has been achieved.


Descriptors :   continuous wave lasers , photonics , microelectromechanical systems , electrooptics , circuits , integration


Distribution Statement : APPROVED FOR PUBLIC RELEASE