Accession Number : AD0476469


Title :   CONTINUOUS PROCESSES FOR FUNCTIONAL ELECTRONIC BLOCKS.


Descriptive Note : Final technical rept. 15 Jun 63-9 Nov 65.


Corporate Author : WESTINGHOUSE ELECTRIC CORP ELKRIDGE MD MOLECULAR ELECTRONICS DIV


Report Date : Nov 1965


Pagination or Media Count : 354


Abstract : The primary goal of this continuous processing program was to substantially improve the oxidation, etching, and diffusion processes as they apply to functional electronic blocks and other planar semiconductor devices. Machines were designed to perform the manufacturing steps in the major areas within the scope of the program: furnace systems and wet chemical and photoengraving processes. Wafers were processed through continuous furnaces at a much higher capacity than with batch furnaces and with distributions comparable to those of high quality batch results. Dendritic web processed through the same furnaces was compared to web and to wafers processed by standard batch methods; the results indicated a definite superiority of the web silicon in conjunction with the continuous processing technique. In the wet chemical and photoengraving areas, where the majority of the tweezer handling occurs, a series of processing machines was designed to be compatible with an 18-wafer universal carrier as a transport device. These machines, flexible to changes and advances in technology, were evaluated while operating on a production-line basis and have increased substantially the overall productivity of the manufacturing process. This program, in general, represents a radical break with traditional processing concepts and constitutes a very significant step on the road to totally automated and computer controlled processing of integrated circuit wafers. (Author)


Descriptors :   *INTEGRATED CIRCUITS , PROCESSING , MACHINES , OPTIMIZATION , OXIDATION , ETCHING , DIFFUSION , PHOTOENGRAVING , PRODUCTION , AUTOMATION , QUALITY CONTROL , EPITAXIAL GROWTH , SILICON , CLEANING , SULFURIC ACID , NITRIC ACID , CONTROLLED ATMOSPHERES , DIBORANES , ARGON , NITROGEN , MATERIALS , REMOVAL , HYDROGEN COMPOUNDS , CHLORIDES , ACCEPTABILITY


Subject Categories : Electrical and Electronic Equipment
      Mfg & Industrial Eng & Control of Product Sys


Distribution Statement : APPROVED FOR PUBLIC RELEASE