Accession Number : AD0474240


Title :   AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.


Descriptive Note : Final development rept. 15 Jun 64-15 Oct 65.


Corporate Author : SIGNETICS CORP SUNNYVALE CA


Report Date : 17 OCT 1965


Pagination or Media Count : 42


Abstract : This report is a summary of the work completed in developing an economical flat package for integrated circuits. This is covered by a design description, processing details, a pilot line description, production cost estimates and reliability test results. The period of this contract was 16 months. (Author)


Descriptors :   *PACKAGING), (*INTEGRATED CIRCUITS, (*PACKAGED CIRCUITS, INTEGRATED CIRCUITS), PROCESSING, PRODUCTION CONTROL, COSTS, RELIABILITY(ELECTRONICS), TEST METHODS, MANUFACTURING, HERMETIC SEALS, SUBSTRATES, PRINTED CIRCUITS, CIRCUIT INTERCONNECTIONS, PANEL BOARDS(ELECTRICITY).


Subject Categories : ELECTRICAL AND ELECTRONIC EQUIPMENT


Distribution Statement : APPROVED FOR PUBLIC RELEASE