Accession Number : AD0470526


Title :   LIQUID METAL EMBRITTLEMENT


Descriptive Note : Interim technical rept.


Corporate Author : FRANKLIN INST RESEARCH LABS PHILADELPHIA PA


Personal Author(s) : Vook, Richard W


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/470526.pdf


Report Date : Aug 1965


Pagination or Media Count : 41


Abstract : An electron microscope investigation of the embrittlement of copper by liquid bismuth has been carried out. Observations were made above the melting point of bismuth (271 deg C) and at room temperature. A uniform bismuth film was formed by evaporation on a thinned copper foil. When this film melted, it tended to agglomerate (depending on the vacuum conditions and surface preparation prior to deposition) and flow along grain boundaries. The rate of flow increased considerably when a tensile stress was applied. Boundaries in contact with liquid bismuth at temperatures above 271 deg C were brittle. Boundaries exposed to liquid bismuth for several hours and tested at room temperature were brittle also. The intergranular nature of the embrittlement was verified by transmission electron diffraction and electron microscopy. No evidence for disloaction pile-ups acting to initiate brittle fracture was obtained.


Descriptors :   *EMBRITTLEMENT , *LIQUID METALS , COPPER , FOILS(MATERIALS) , GRAIN BOUNDARIES , BISMUTH , BRITTLENESS , FRACTURE(MECHANICS) , ZINC


Subject Categories : Metallurgy and Metallography


Distribution Statement : APPROVED FOR PUBLIC RELEASE