Accession Number : AD0458127


Title :   DEVELOPMENT OF HIGH THERMAL CONDUCTIVITY ELECTRICAL EMBEDDING COMPOUNDS.


Descriptive Note : Technical memo.


Corporate Author : NAVAL APPLIED SCIENCE LAB BROOKLYN NY


Report Date : 15 Feb 1965


Pagination or Media Count : 12


Abstract : This report describes the development of high thermal conductivity electrical embedding compounds utilizing a technique wherein the mold is first filled with large particle, high thermal conductivity tabular alumina, then impregnated by mixtures of epoxy compound and small particle tabular alumina. Contained herein, are the pertinent results of a previously reported study which led to the development of three high thermal conductivity compounds, and the further development of several additional compounds with still higher conductivities. (Author)


Descriptors :   *EMBEDDING SUBSTANCES , THERMAL CONDUCTIVITY , ALUMINUM COMPOUNDS , OXIDES , IMPREGNATION , EPOXY RESINS , ELECTRICAL INSULATION , PARTICLE SIZE , CASTING , VACUUM APPARATUS


Distribution Statement : APPROVED FOR PUBLIC RELEASE