Accession Number : AD0455010


Title :   PLANAR INTEGRATION OF THIN FILM UNITS.


Descriptive Note : Quarterly progress rept. no. 3, 15 Jul-14 Oct 64,


Corporate Author : WESTINGHOUSE DEFENSE AND SPACE CENTER BALTIMORE MD


Personal Author(s) : Lauriente, M ; Winter, J M ; Wyble, C W


Report Date : 14 Oct 1964


Pagination or Media Count : 1


Abstract : The purpose of this effort is the advancement of a practical microminiature system for compliant planar electrical interconnections between thin film circuits, discrete parts and solid circuits. The advanced types of discrete parts and circuits of interest are those which are in the microminiature 'chip' and silicon semiconductor integrated circuit form which are suitable for recessing flush with one surface of a microcircuit wafer. It is a design objective that the deposited interconnection shall have a mean-time-to-failure to 10 to the 9 hours at a 60% confidence level. Techniques used to fabricate the experimental models are described with the benefit of flow diagrams. Oxidation of aluminum and copper pads due to exposure to air at the curing temperature of the resin required rework of these pads. It was possible to clean the copper pads with a mild etchant but the aluminum pads had to be metallized with chrme-gold. Some dispersion was observed after deposition of the heavy interconnects extending beyond the width of the mask. Some theories are offered to explain the phenomenon. (Author)


Descriptors :   CIRCUIT INTERCONNECTIONS , SUBMINIATURE ELECTRONIC EQUIPMENT , SILICON , RELIABILITY(ELECTRONICS) , OXIDATION , ALUMINUM , COPPER , TEMPERATURE , ADHESION , GLASS , ENVIRONMENTAL TESTS , PROCESSING


Distribution Statement : APPROVED FOR PUBLIC RELEASE