Accession Number : AD0450549
Title : AN ECONOMICAL FLAT PACKAGE FOR INTEGRATED CIRCUITS.
Descriptive Note : Interim development rept. no. 1, 15 June15 Sep 64.
Corporate Author : SIGNETICS CORP SUNNYVALE CA
Report Date : 15 Sep 1964
Pagination or Media Count : 22
Abstract : The schedule for making the first seal of the metal leads to the package substrate is complete. By a process of electroplating and etching metal film interconnections have been laid down, but many problems remain in this area. A few circuits were assembled on this substrate and where all previous steps were satisfactory, electrical continuity has been established. (Author)
Descriptors : PACKAGING , CIRCUIT INTERCONNECTIONS , CHEMICAL MILLING , ELECTROPLATING , PRODUCTION , SILICON , ALUMINUM
Distribution Statement : APPROVED FOR PUBLIC RELEASE