Accession Number : AD0447713


Title :   PLANAR INTEGRATION OF THIN FILM UNITS.


Descriptive Note : Quarterly progress rept. no. 2, 15 Apr14 July 64,


Corporate Author : WESTINGHOUSE DEFENSE AND SPACE CENTER BALTIMORE MD


Personal Author(s) : Lauriente, M ; Winter, J M ; Wyble, C W


Report Date : 14 Jul 1964


Pagination or Media Count : 29


Abstract : The object of this study is to establish and demonstrate highly reliable and practical methods for mounting and subsequent simultaneous interconnection of discrete chip parts and silicon semiconductor integrated circuits to previously deposited thin film circuitry on a common microcircuit wafer. (Author)


Descriptors :   *CIRCUIT INTERCONNECTIONS , SUBMINIATURE ELECTRONIC EQUIPMENT , SILICON , SILICATES , PROCESSING , TEMPERATURE , JIGS


Distribution Statement : APPROVED FOR PUBLIC RELEASE