Accession Number : AD0439238


Title :   LOW COST ARMY MICROMODULE PROGRAM


Descriptive Note : Quarterly rept. no. 2, 1 Oct-31 Dec 63


Corporate Author : RADIO CORP OF AMERICA CAMDEN NJ


Personal Author(s) : Margolin, P.


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/439238.pdf


Report Date : 31 DEC 1963


Pagination or Media Count : 48


Abstract : The selected functional assembly of the MICRORAC computer, the Timing Level Generator, was analyzed; and four module types were developed to satisfy its requirements. The modules contain either 2, 3, or 4 Integrated Circuit Packages and one interconnection wafer. A new Integrated Circuit Package having 14 leads was developed as a compatible unit for assembly into the new module. Each terminal of the package connects with an alternate riser wire of the module. Design rules are established for allocating pin functions in the 28/30 module, for allocating terminal leads of the integrated circuit packages, and for employing intramodule interconnection wafers. Results indicate that for an employing intramodule interconnection wafers. Results indicate that the 28/20 module assembly will satisfy the low-cost objective of this program, because standard logic-element monolithic devices are available in suitable flat packages; and instant compatibility of the integrated circuit package and module is obtained by substituting a special lead frame in the vendor's standard product. Each module employs only one of two standardized interconnection wafers. The logic content of the 28/20 module assembly has a density of at least 5 times greater than the standard 12-lead micromodule. (Author)


Descriptors :   *INTEGRATED CIRCUITS , *MINIATURE ELECTRONIC EQUIPMENT , DIGITAL SYSTEMS , THIN FILMS , LOGIC CIRCUITS , HYBRID CIRCUITS , TIMING CIRCUITS.


Subject Categories : ELECTRICAL AND ELECTRONIC EQUIPMENT


Distribution Statement : APPROVED FOR PUBLIC RELEASE