Accession Number : AD0439237


Title :   LOW COST ARMY MICROMODULE PROGRAM.


Descriptive Note : Quarterly rept. no. 1, 1 July-30 Sep 63,


Corporate Author : RADIO CORP OF AMERICA CAMDEN N J


Personal Author(s) : MARGOLIN,P


Report Date : 30 Sep 1963


Pagination or Media Count : 43


Abstract : This program is directed toward establishing design criteria for low-cost linear and digital modular assemblies by combining the best features of the micromodule packaging technique with microelectronic techniques and devices employing solid silicon, thin films and hybrid circuits. The MICRORAC computej was studied and an appropriate functional assembly (the Timing Level Generator) was selected to serve as the demonstration vehicle for the low-cost micromodule. The monolithic silicon device was chosen as the best approach for achieving lowcost modules. A survey of digital devices manufactured by nine semiconductor companies revealed that Motorola (MECL) and Fairchild (Micrologic II) have off-the-shelf devices which can meet the performance requiremtns of the MICRORAC computer. A module structure was selected which would have 28 internal riser wires of which 20 emerge from the bottom face. Two possibilities for the leads, one a 12-terminal frame and the other a 14-terminal lead frame, were under evaluation. A 28-notch interconnection wafer was proposed as a preliminary design. (Author)


Descriptors :   SUBMINIATURE ELECTRONIC EQUIPMENT , PACKAGING , THIN FILM STORAGE DEVICES , SILICON , RESEARCH MANAGEMENT , TIME STUDIES , TRANSMITTER RECEIVERS , COMPUTER LOGIC , SOLDERING , TRANSMITTER RECEIVERS , PRINTED CIRCUITS


Distribution Statement : APPROVED FOR PUBLIC RELEASE