Accession Number : AD0433891


Title :   LOW-COST MICROCIRCUITS FOR MICROASSEMBLIES.


Descriptive Note : Quarterly rept. no. 2, 1 Oct 63-1 Jan 64,


Corporate Author : XEROX CORP ROCHESTER N Y


Personal Author(s) : Mytych,C


Report Date : 01 Jan 1964


Pagination or Media Count : 55


Abstract : An approach to low-cost resistor and capacitor elements utilizing the microelement wafer concept and the double-etch process is under investigation. Multi-layered films were placed on ceramic substrates by vacumm and electroless deposition techniques to form microelement wafers. The multi-layered films are converted to resistor and capacitor elements by subtractive methods, utilizing xerographic stenciling and selective etching. Data covering T.C.R., temperature cycling, load life stability and yield for resistor elements is presented. The capacitor and micromodule assembly programs are outlined. (Author)


Descriptors :   *SUBMINIATURE ELECTRONIC EQUIPMENT , *FIXED RESISTORS , *FIXED CAPACITORS , SUBMINIATURE ELECTRONIC EQUIPMENT , SUBMINIATURE ELECTRONIC EQUIPMENT , PHOTOENGRAVING , ENVIRONMENTAL TESTS , PRINTED CIRCUITS , MODULES(ELECTRONICS) , COPPER , CHROMIUM , CHEMICAL MILLING


Distribution Statement : APPROVED FOR PUBLIC RELEASE