Accession Number : AD0433812


Title :   PRODUCTION ENGINEERING MEASURE. MECHANIZATION OF SEMICONDUCTOR DEVICES 2N559-2N1094.


Descriptive Note : Quarterly progress rept. no. 24, 1 Oct-31 Dec 63,


Corporate Author : WESTERN ELECTRIC CO INC LAURELDALE PA


Personal Author(s) : Reppert,M N


Report Date : 31 Dec 1963


Pagination or Media Count : 40


Abstract : Improvements were made to the diffusion and the stripe evaporation and alloying operations. Refinement of mechanized operations continued. Refinement of piece part cleaning, was completed with the addition of improved loading stations on two machines. The most extensive changes pending on the other operations involve addition of subassembly loading mechanisms to the Header Assembling and the Strip Perforating and Welding machines. Development of material handling system refinements is also scheduled to continue. While designing a load-unload mechanism for ''Slide-Pac'' header trays, another tray design was proposed. Improved header handling techniques were developed for application between heater plating and wafer bonding. In the proposed approach, the steel strip used to support the headers during plating will be utilized until the headers are loaded into trays for wafer bonding. (Author)


Descriptors :   *AUTOMATION , PRODUCTION , MANUFACTURING , TRANSISTORS , PRODUCTION , BONDING , ELECTRIC WIRE , SEMICONDUCTING FILMS , WELDING , DIFFUSION , SILICON , OXIDES , MACHINES , RELIABILITY(ELECTRONICS)


Distribution Statement : APPROVED FOR PUBLIC RELEASE