Accession Number : AD0433115


Title :   PACKAGING MINIATURIZATION. CHARGE NUMBERS 31-8027-0201-01, 31-8027-0901 AND RES 2 AND 4,


Corporate Author : LOCKHEED MISSILES AND SPACE CO SUNNYVALE CALIF


Personal Author(s) : Abe,Shiro ; Churchon,Stuart ; Newman,H L


Report Date : 15 Sep 1961


Pagination or Media Count : 137


Abstract : High Power Amplifier Para-Plate modules were built and functionally tested. A few prototype modules using Weld Pack and Chem-Mill techniques were constructed. Some prototype Para-Plate low power flip flops were assembled but not evaluated. Several other versions of the low power flip flop were investigated. This report describes the design work and includes illustrations and tables plus preliminary test results, layout artwork, drawings, encapsulation techniques, conclusions and recommendations. (Author)


Descriptors :   *MODULES(ELECTRONICS) , *SWITCHING CIRCUITS , MANUFACTURING , MODULES(ELECTRONICS) , MODULES(ELECTRONICS) , AMPLIFIERS , POWER , ENCAPSULATION , TRANSISTORS , PRODUCTION , RESISTORS , CAPACITORS , WELDING , CHEMICAL MILLING , MINIATURE ELECTRONIC EQUIPMENT , PACKAGED CIRCUITS , TABLES(DATA) , PERFORMANCE(ENGINEERING) , SEMICONDUCTOR DIODES , ELECTRIC TERMINALS , SOLDERING , WIRING DIAGRAMS , PRINTED CIRCUITS , TEMPERATURE , CONFIGURATIONS , RELIABILITY(ELECTRONICS)


Distribution Statement : APPROVED FOR PUBLIC RELEASE