Accession Number : AD0431161


Title :   THERMAL DESIGNS FOR MICRO MODULES.


Descriptive Note : Quarterly rept. no. 2, 1 Aug-1 Nov 63,


Corporate Author : UNITED TECHNOLOGIES CORP WINDSOR LOCKS CT HAMILTON STANDARD DIV


Personal Author(s) : Taudvin, P C ; Green, R J


Report Date : 01 Nov 1963


Pagination or Media Count : 1


Abstract : Fabrication of the preliminary modules was delayed for various reasons. Fabrication of resistors on beryllia presented a problem both in the deposition and scribing processes. The surface smoothness of these wafers was not comparable to the alumina wafers and the original deposition processes had to be altered to saisfactorily deposit a thin film layer. Because of the heat conductivity of the beryllia, electron beam scribing of these wafers required a much larger beam energy at the cutting surface to isolate the resistive paths on the thin film. Utilizing alumina substrates on hand, a single unit was fabricated to check out all anticipated manufacturing processes. Eight alumina and two beryllia preliminary modules were fabricated. Difficulties were encountered in manufacturing the latter. These modules were thermally tested in the unencapsulated state. Erratic results were obtained with one of the alumina modules and this unit was removed from further testing. Experimental radiator and lug models were made and soldered to plated surfaces to demonstrate feasibility of the design and the joining method. A vibration fixture was designed and fabricated for vibrating the preliminary modules as mounted on the PC board. For the fabrication of the modular assembly, all wafers have had area resistors deposited on them. (Author)


Descriptors :   SUBMINIATURE ELECTRONIC EQUIPMENT , SUBMINIATURE ELECTRONIC EQUIPMENT , MODULES(ELECTRONICS) , THERMISTORS , THERMOCOUPLES , SILICATES , RESISTORS , TEMPERATURE , TEST METHODS , ENCAPSULATION


Distribution Statement : APPROVED FOR PUBLIC RELEASE