Accession Number : AD0429542


Title :   PRODUCTION ENGINEERING MEASURE FOR MULTILAYER PRINTED WIRING BOARD.


Descriptive Note : Quarterly rept. no. 3, 1 Jan-31 Mar 63,


Corporate Author : PHOTOCIRCUITS CORP GLEN COVE N Y


Personal Author(s) : Messner,G ; McCaw,R ; Paluszek,M


Report Date : 31 Mar 1963


Pagination or Media Count : 1


Abstract : An invstigation of solder fillet formation methods on individual layers, as well as some other processes, was carried out and some alternate methods of manufacture were developed. The pro cess standards and production rates for the majority of manufacturing steps have been issued. Overall production capacity and manpower requirements have been evaluated for a continuous production rate of 60 six-layered printed wiring boards per 8-hour shift using the clearance hole method of construction. Various design approaches for the most versatile and economical special tooling suitable for the high production rate of different board configurations. (Author)


Descriptors :   *PRINTED CIRCUITS , *SUBMINIATURE ELECTRONIC EQUIPMENT , PRODUCTION , SOLDERING , LAMINATES , PLATING , PHOTOENGRAVING , JIGS , TEMPLATES , DRILLS , QUALITY CONTROL , ADHESIVES , TEST EQUIPMENT , ELECTRONIC EQUIPMENT , GLASS TEXTILES


Distribution Statement : APPROVED FOR PUBLIC RELEASE