Accession Number : AD0427347


Title :   ENHANCED MICRO-MODULE INTERCONNECTION. AN HERMETIC PACKAGING SYSTEM FOR THE INTEGRATION OF MICRO CIRCUITS.


Descriptive Note : Quarterly rept. no. 1, 12 June-30 Sep 63,


Corporate Author : UNITED TECHNOLOGIES CORP WINDSOR LOCKSCT HAMILTON STANDARD DIV


Personal Author(s) : Lang, G F ; Garibotti, D J


Report Date : 04 Jan 1963


Pagination or Media Count : 1


Abstract : The Enhanced Micro-Module - EMM - is an all electron beam welded, hermetically sealed interconnection - packaging system which is compatible with all approaches to microminiaturization. Each module comprises up to ten stacked microwafers .310 x .310 inches on a side which are interconnected by 36 electron beam welded conductor ribbons. Communication with external circuitry is achieved through a hermetic header which is electron beam welded to the can. The high interconnection capability of the system is uniquely suited for packaging of uncased active devices and semiconductor circuits. Program 'Enhanced Micro-Module Interconnections (A Hermetic Packaging System For The Integration of MicroCircuits)' has been subdivided into the following phases: (1) Preproduction effort, (2) Tooling, and (3) Pilot line and production run. Specifically, considerable effort has been directed toward the definition of materials and selection of processes compatible with production environments. Previously developed laboratory techniques have been under evaluation for potential extrapolation into manufacturing steps. (Author)


Descriptors :   INTEGRATED SYSTEMS , PRODUCTION , ELECTRONS , WELDING , VAPORIZATION , BONDING , ELECTRIC CONNECTORS


Distribution Statement : APPROVED FOR PUBLIC RELEASE