Accession Number : AD0163628
Title : Method and Apparatus for Joining Plated Dielectric-Form Waveguide Components.
Descriptive Note : Patent,
Corporate Author : OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C
Personal Author(s) : Jones,Howard S. , Jr
Report Date : 04 MAY 1971
Pagination or Media Count : 4
Abstract : The patent describes a plated dielectric waveguide component which includes a dielectric foam substrate propagating medium and a thin metallic surface encapsulating the substrate for carrying a conducting current therealong and a method of interconnecting the same. The waveguide component has a quarter wavelength step-shaped end which may be readily butt joined with another plated dielectric waveguide component having a similar construction and matching end whereby a lightweight, sturdy and highly efficient connection is obtained.
Descriptors : (*WAVEGUIDE COUPLERS, *PATENTS), DIELECTRICS, JOINTS, METAL FILMS, FOAM
Subject Categories : ELECTRICAL AND ELECTRONIC EQUIPMENT
Distribution Statement : APPROVED FOR PUBLIC RELEASE