Accession Number : AD0163628


Title :   Method and Apparatus for Joining Plated Dielectric-Form Waveguide Components.


Descriptive Note : Patent,


Corporate Author : OFFICE OF THE SECRETARY OF THE ARMY WASHINGTON D C


Personal Author(s) : Jones,Howard S. , Jr


Report Date : 04 MAY 1971


Pagination or Media Count : 4


Abstract : The patent describes a plated dielectric waveguide component which includes a dielectric foam substrate propagating medium and a thin metallic surface encapsulating the substrate for carrying a conducting current therealong and a method of interconnecting the same. The waveguide component has a quarter wavelength step-shaped end which may be readily butt joined with another plated dielectric waveguide component having a similar construction and matching end whereby a lightweight, sturdy and highly efficient connection is obtained.


Descriptors :   (*WAVEGUIDE COUPLERS, *PATENTS), DIELECTRICS, JOINTS, METAL FILMS, FOAM


Subject Categories : ELECTRICAL AND ELECTRONIC EQUIPMENT


Distribution Statement : APPROVED FOR PUBLIC RELEASE