Accession Number : AD0014907


Title :   ELEVATED TEMPERATURE RESISTANT MODIFIED EPOXIDE RESIN ADHESIVES FOR METALS


Descriptive Note : Progress rept. 1 Dec 1951-30 Nov 1952


Corporate Author : SHELL DEVELOPMENT CO EMERYVILLE CA


Personal Author(s) : NAPS, M


Full Text : https://apps.dtic.mil/dtic/tr/fulltext/u2/014907.pdf


Report Date : 30 Nov 1952


Pagination or Media Count : 62


Abstract : A metal-to-metal adhesive was developed which is useful at temperatures up to 500 deg F. The adhesive (formulation no. 422) is a 1-package system composed of Epon 1001 resin, Plyophen 5023, and dicyandiamide as the curing agent. Al dust was used as the reinforcing filler. The adhesive was cured at contact pressure and at 330 deg F. Bonds to Al from adhesive formulation no. 422 had a shear strength of 2100 psi at room temperature and 1400 psi at 500 deg F. Bond strength after approximately 70 hr aging at 500 deg F was 1000 psi. Aging the adhesive bonds for 200 hr at 400 deg F reduced the shear strength from 1750 to 1340 psi. Cycling the adhesive bonds between room temperature and elevated temperature (up to 500 deg F) 50 times had no apparent effect upon the bond strength. Adhesive formulation no. 422 is used as a pliable tape supported o a glass fabric carrier. The adhesive, which has a storage life of 1 mo at 40 deg F, must be stored under refrigeration. Systematic variation of the concentration of the components of the adhesive led to the development of the following formula (parts by weight): 33 Epon 1001 + 67 Polyophen 5023 + 100 Al dust + 6 dicyandiamide. Higher Epon 1001 resin content decreased hot strength, and higher phenolic content increased brittleness and decreased thermal resistance upon aging. Either less filler or curing without dicyandiamide reduced adhesive shear strength, especially at room temperature.


Descriptors :   *EPOXY RESINS , *ADHESIVE BONDING , HIGH TEMPERATURE , FORMULATIONS , ROOM TEMPERATURE , VARIATIONS , DUST , BRITTLENESS , BONDED JOINTS , PRESSURE , BONDING , CURING AGENTS , ADHESIVES , PHENOLS , REINFORCING MATERIALS , THERMAL RESISTANCE , SHEAR STRENGTH , FILLERS , CYANAMIDES


Subject Categories : Adhesives, Seals and Binders


Distribution Statement : APPROVED FOR PUBLIC RELEASE